Company Filing History:
Years Active: 2000-2002
Title: John J Pessarchick: Innovator in Electronic Circuit Packaging
Introduction
John J Pessarchick is a notable inventor based in Binghamton, NY (US). He has made significant contributions to the field of electronic circuit packaging, holding a total of 3 patents. His work focuses on innovative methods for connecting conductive layers in electronic devices.
Latest Patents
Pessarchick's latest patents include a method for the use of blind vias for soldered interconnections between substrates and printed wiring boards. This method involves placing blind vias in both a first substrate and a second substrate, allowing for effective electrical connections between layers. Another significant patent is the method of electrically connecting substrates using solder balls, which similarly utilizes blind vias to ensure reliable connections in electronic circuit packages.
Career Highlights
John J Pessarchick is currently employed at International Business Machines Corporation (IBM). His work at IBM has allowed him to develop and refine his innovative techniques in electronic circuit design, contributing to advancements in the industry.
Collaborations
Throughout his career, Pessarchick has collaborated with notable coworkers such as Gregg J Armezzani and Kishor V Desai. These collaborations have further enhanced his work and contributed to the development of new technologies in electronic circuit packaging.
Conclusion
John J Pessarchick is a distinguished inventor whose work in electronic circuit packaging has led to multiple patents and significant advancements in the field. His innovative methods continue to influence the design and functionality of electronic devices.