San Bernardino, CA, United States of America

John Hildebrand


Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2012

Loading Chart...
1 patent (USPTO):Explore Patents

Title: John Hildebrand: Innovator in Packaging Technology

Introduction

John Hildebrand is a notable inventor based in San Bernardino, CA (US). He has made significant contributions to the field of packaging technology, particularly with his innovative designs and systems. His work has led to advancements that enhance efficiency and functionality in packaging processes.

Latest Patents

Hildebrand holds a patent for a form, fill, and seal system. This system features a product fill assembly, a tube forming assembly, and a fitment securing assembly. It allows for the relative positioning of the fitment that is to be applied to the film forming the bags at various points along the film. The fitment securing assembly can be positioned relative to the tube forming assembly, enabling adjustments that allow a fitment to be located at multiple locations on a finished bag. This innovation streamlines the packaging process and improves the versatility of bag production.

Career Highlights

John Hildebrand is currently employed at Winpak Lane, Inc., where he continues to develop and refine packaging technologies. His expertise in the field has made him a valuable asset to the company and the industry as a whole.

Collaborations

Hildebrand has worked alongside talented colleagues, including Mark Griffin and Steven D. Davis. Their collaborative efforts have contributed to the success of various projects within the company.

Conclusion

John Hildebrand's innovative contributions to packaging technology exemplify the impact of dedicated inventors in the industry. His patent for the form, fill, and seal system showcases his commitment to enhancing packaging efficiency and functionality.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…