Company Filing History:
Years Active: 1996
Title: Innovations by John H Baird
Introduction
John H Baird is an accomplished inventor based in Scottsdale, AZ (US). He has made significant contributions to the field of electronic devices through his innovative patents. His work focuses on enhancing the functionality and efficiency of electronic interconnects.
Latest Patents
One of John H Baird's notable patents is for a thermoplastic interconnect for electronic devices. This patent, which he holds, describes conductive thermoplastic interconnects that can take the form of bumps or spheres. These interconnects are designed for applications where metal bumps are conventionally used. The process involves attaching the bumps by retaining them in a vacuum fixture and momentarily contacting them with a heated substrate, which causes wetting of the conductive thermoplastic bump.
Career Highlights
Throughout his career, John H Baird has demonstrated a commitment to innovation in electronic device technology. His patent reflects his expertise in developing advanced materials and methods that improve electronic connectivity. With a total of 1 patent, he has established himself as a valuable contributor to the field.
Collaborations
John H Baird has worked alongside Francis J Carney, Jr., collaborating on various projects that aim to push the boundaries of electronic device technology. Their partnership has fostered an environment of creativity and innovation.
Conclusion
John H Baird's contributions to the field of electronic devices through his innovative patents highlight his role as a significant inventor. His work continues to influence the development of advanced technologies in the industry.