John Fredrick May

Title: John Fredrick May: Innovator in Module Package Design

Introduction

John Fredrick May is a notable inventor based in Bend, OR (US). He has made significant contributions to the field of module package design, showcasing his innovative spirit through his patented inventions.

Latest Patents

John holds a patent for a unique lid cover spring design. This invention involves a module package that includes a substrate and at least one device component positioned on the substrate. The module package lid is designed to cover the device component and features a plateau portion. Additionally, it incorporates at least one mounting spring that secures the lid and device component in place. Each mounting spring consists of a middle portion, an end portion with a mounting hole, and a curved section that prevents contact with the module package lid's corner. This design enhances the stability and functionality of the module package.

Career Highlights

John Fredrick May is currently employed at Microsemi Corporation, where he continues to innovate and develop new technologies. His work at the company has allowed him to apply his expertise in module package design and contribute to various projects.

Collaborations

John collaborates with his coworker, Benjamin A Samples, to further enhance their projects and drive innovation within their field.

Conclusion

John Fredrick May's contributions to module package design exemplify his dedication to innovation and technology. His patent for the lid cover spring design reflects his ability to solve complex engineering challenges.