John F Moulder

Title: Innovations of John F Moulder

Introduction

John F Moulder is a notable inventor based in Sun Fish Lake, MN (US). He has made significant contributions to the field of integrated circuits, particularly through his innovative patent.

Latest Patents

Moulder holds a patent for an integrated circuit metallization technique. This process involves the deposition of a barrier layer of chromium (Cr) or titanium (Ti) in a partial atmosphere of nitrogen (N.sub.2) using argon (Ar) sputtering gas on a silicon (Si) layer. The incorporation of nitrogen into the barrier layer enhances the performance of the integrated circuits. Following this, conductor materials such as gold, silver, or low-temperature eutectic solders are deposited on the barrier layer. This technique effectively reduces the migration of silicon and chromium through and over the conductor material, resulting in a wettable and bondable surface. Consequently, this leads to greater bond strength and reliability when attaching the die to a bonding pad using conventional heat treatment methods.

Career Highlights

John F Moulder is associated with the Perkin-Elmer Corporation, where he has contributed to advancements in integrated circuit technology. His work has been instrumental in improving the manufacturing processes of these essential components.

Collaborations

Moulder has collaborated with Ronald S Nowicki, further enhancing the innovative efforts within his field.

Conclusion

John F Moulder's contributions to integrated circuit technology through his patented metallization technique exemplify the importance of innovation in the electronics industry. His work continues to influence the reliability and performance of integrated circuits today.