Clifton Park, NY, United States of America

John F McDonald

USPTO Granted Patents = 10 

Average Co-Inventor Count = 2.2

ph-index = 7

Forward Citations = 198(Granted Patents)


Company Filing History:


Years Active: 1981-2010

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10 patents (USPTO):Explore Patents

Title: Innovations of John F McDonald: A Pioneer in Three-Dimensional Integration

Introduction

John F McDonald, an inventive mind from Clifton Park, NY, has made significant contributions to the field of integrated circuits, holding a remarkable portfolio of 10 patents. His work focuses on enhancing the capabilities of three-dimensional (3D) integration technologies, which are pivotal for the future of computing and electronics.

Latest Patents

Among his latest innovations, McDonald has developed a novel three-dimensional face-to-face integration assembly. This invention features a via designed for connecting metallization layers of chips bonded in a face-to-face configuration. His patented methods for fabricating the via allow it to serve as an interconnection between metallization layers in 3D stacked integrated circuits. This advancement facilitates the formation of high-density, low-resistance interconnections, which are essential for improving the performance of modern electronic devices.

Career Highlights

Throughout his esteemed career, John McDonald has been associated with prominent organizations such as Rensselaer Polytechnic Institute and General Electric Company. His experience in these esteemed institutions has been instrumental in shaping his expertise and has contributed to his innovative accomplishments within the realm of integrated circuit design.

Collaborations

While working on his groundbreaking inventions, McDonald has collaborated with notable colleagues, including Henry August Scarton and Toh-Ming Lu. Their combined expertise and diverse perspectives have undoubtedly enriched the development and application of their innovative technologies.

Conclusion

John F McDonald stands out as a notable inventor whose contributions are shaping the future of integrated circuit technology. His latest patents emphasize the importance of high-density interconnections in 3D integration, paving the way for advancements in various applications. With his impressive track record and collaborative spirit, McDonald continues to inspire and influence the field of electronics and innovation.

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