John Di Santis

Title: The Innovative Journey of John Di Santis

Introduction

John Di Santis is an accomplished inventor based in Wappingers Falls, NY, known for his contributions to the field of plating technology. With a passion for innovation, he has developed unique solutions that address specific challenges in manufacturing methods. His work is particularly significant in the realm of electronic packaging.

Latest Patents

One of John Di Santis's notable patents is titled "Apparatus and method for plating pin grid array packaging modules." This patent encompasses an apparatus and a method designed for plating pin grid array packaging modules. The invention features a fixture that can simultaneously hold multiple modules, ensuring that the three-dimensional bottom surface metallurgy (BSM) is sealingly protected during the plating of the top surface metallurgy (TSM). This innovation enhances the efficiency and effectiveness of the plating process, which is crucial in the electronics industry.

Career Highlights

John Di Santis is associated with the International Business Machines Corporation (IBM), where he applies his expertise in developing cutting-edge technologies. His role at IBM allows him to collaborate with other talented individuals and contribute to significant advancements in the industry.

Collaborations

In his career, John has had the opportunity to work alongside prominent colleagues, including Glen Nelson Biggs and Paul F. Findeis. These collaborations often lead to groundbreaking ideas and the enhancement of existing technologies, fostering an environment of creativity and innovation.

Conclusion

John Di Santis exemplifies the spirit of innovation in the technology sector. Through his patent and work at IBM, he continues to push the boundaries of what is possible in electronic packaging. His contributions are invaluable to the industry and inspire future generations of inventors.