Company Filing History:
Years Active: 2014
Title: Innovations of John Dangtran
Introduction
John Dangtran is an accomplished inventor based in San Jose, California. He has made significant contributions to the field of sensor technology, particularly through his innovative patent related to sensor device packaging. His work reflects a deep understanding of materials and their properties, which is crucial in the development of reliable sensor devices.
Latest Patents
John Dangtran holds a patent for a sensor device packaging. This invention involves a die pad that receives a sensor device, such as a MEMS device. The MEMS device has a first coefficient of thermal expansion (CTE), while the die pad is made of a material with a second CTE that is compliant with the first. The design includes a base and a support structure that minimizes forces experienced by the die pad and MEMS device during thermal expansion or contraction. This innovative approach enhances the durability and performance of sensor devices.
Career Highlights
Throughout his career, John has worked with notable companies, including S3C, Inc. and Nagano Keiki Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to various projects in the sensor technology sector.
Collaborations
John has collaborated with professionals in his field, including his coworker Roger Horton. These partnerships have fostered an environment of innovation and creativity, leading to advancements in sensor technology.
Conclusion
John Dangtran's contributions to sensor device packaging exemplify his expertise and commitment to innovation. His work continues to influence the development of reliable sensor technologies in the industry.