Company Filing History:
Years Active: 1997-2004
Title: John A. Emerson: Innovator in Micro-Fluidic Device Packaging
Introduction
John A. Emerson is a notable inventor based in Albuquerque, NM, USA. He holds a total of four patents, showcasing his expertise in the field of micro-fluidic devices and innovative packaging solutions.
Latest Patents
Among his latest innovations, Emerson has developed a cutting-edge method of packaging and assembling micro-fluidic devices. This patent introduces a new architecture designed to efficiently package surface micromachined electro-microfluidic devices. The technology connects fluids from a macro-scale (microliters) to a device scale (picoliters) using two scales of packaging. The larger package includes a circuit board equipped with embedded fluidic channels and standard fluidic connectors, known as a Fluidic Printed Wiring Board. This system interfaces with a smaller package, called the Electro-Microfluidic Dual-Inline-Package (EMDIP), which effectively channels fluid to the microfluidic integrated circuit (MIC). The fluidic connection is established through Bosch-etched holes, allowing precise fluid movement to surface micromachined channels on the MIC's front, while electrical connection is made to bond pads on the front as well.
Career Highlights
Throughout his career, John A. Emerson has made significant contributions to the field while working with prominent companies such as Sandia Corporation and Atlantic Richfield Company. His innovative spirit and dedication to advancing technology have positioned him as a generous contributor to micro-fluidic device architecture.
Collaborations
Emerson has collaborated with esteemed colleagues in his field, including Gilbert L. Benavides and Paul Charles Galambos. These collaborations have fostered the exchange of innovative ideas and enhanced the development of micro-fluidic technologies.
Conclusion
John A. Emerson's work in micro-fluidic device packaging is a testament to his inventive mindset and technical skills. With four patents to his name and a robust career, he continues to inspire future innovations in this critical area of technology. His contributions are sure to influence the evolution of devices that rely on precise fluid control and assembly methods.