Company Filing History:
Years Active: 1989
Title: Innovations by Johannes Fellinger in Electronic Component Fastening
Introduction
Johannes Fellinger is a notable inventor based in Unterhaching, Germany. He has made significant contributions to the field of electronic component fastening. His innovative methods have the potential to enhance the efficiency and effectiveness of electronic assembly processes.
Latest Patents
Fellinger holds a patent for a method for fastening electronic components to a substrate using a film. This method involves creating a connecting layer with excellent adhesion and electrical and thermal conductivity through sintering a metal powder layer. The process utilizes a solvent-free presintered film made from a metal powder paste, such as silver powder. The film is specifically designed to fasten components by being punched according to the component's cross-section. The manufacturing process employs a specific solvent, controlled heating rates, and precise holding times at elevated temperatures. The fastening occurs at a minimum temperature of 150°C and a mechanical pressure of at least 30 N/cm². This innovative approach allows for faster methods and sintering at lower temperatures and pressures.
Career Highlights
Johannes Fellinger is associated with Siemens Aktiengesellschaft, a leading global technology company. His work at Siemens has allowed him to develop and refine his innovative methods for electronic component fastening. Fellinger's expertise in this area has positioned him as a valuable asset to his team and the industry.
Collaborations
Fellinger has collaborated with his coworker, Werner Baumgartner, to further advance their research and development efforts in electronic component technologies. Their combined expertise has contributed to the successful implementation of innovative solutions within their projects.
Conclusion
Johannes Fellinger's contributions to the field of electronic component fastening demonstrate his commitment to innovation and excellence. His patented methods have the potential to revolutionize the way electronic components are assembled, leading to more efficient manufacturing processes.