Company Filing History:
Years Active: 2011
Title: Joerg Trodler: Innovator in Solder Paste Technology
Introduction
Joerg Trodler is a notable inventor based in Erlensee, Germany. He has made significant contributions to the field of solder paste technology, particularly with his innovative approach to resin-free solder pastes. His work has implications for various applications in electronics manufacturing.
Latest Patents
Trodler holds a patent for "Solder pastes comprising nonresinous fluxes." This invention describes a resin-free solder paste made from a metal powder, specifically soft solder, and a gel. The gel is designed to leave no residue on the metal surface during the remelting of the metal powder. The formulation is stable during storage and includes carboxylic acid(s), amine(s), and solvent(s). This technology is particularly useful in applications such as power modules, die-attach, chip-on-board, System-in-Package (SiP), wafer-bumping, and Surface Mounted Technology (SMT). The use of his resin-free soft solder pastes eliminates the need for cleaning before protective coating processes, significantly reducing the formation of pores in solder bumps.
Career Highlights
Throughout his career, Joerg Trodler has worked with prominent companies in the industry, including W.C. Heraeus GmbH and Heraeus Deutschland GmbH & Co. KG. His experience in these organizations has allowed him to develop and refine his innovative solder paste technologies.
Collaborations
Trodler has collaborated with notable colleagues such as Wolfgang Schmitt and Christian Loosz. These partnerships have contributed to the advancement of solder paste technology and its applications in the electronics sector.
Conclusion
Joerg Trodler's contributions to solder paste technology demonstrate his innovative spirit and commitment to improving manufacturing processes in electronics. His patent for resin-free solder pastes is a testament to his expertise and the impact of his work in the field.