Company Filing History:
Years Active: 2023
Title: Jinkai Li: Innovator in Composite Materials
Introduction
Jinkai Li is a prominent inventor based in Jinan, China. He has made significant contributions to the field of materials science, particularly in the development of composite materials. His innovative approach has led to advancements that are beneficial for industrial applications.
Latest Patents
Jinkai Li holds a patent for a "Preparation method for alumina/titanium silicon carbide composite material." This invention involves creating a composite material by ensuring uniform contact between titanium aluminum carbide (TiAlC) and silicon monoxide (SiO), followed by vacuum sintering. The resulting composite material exhibits high compactness and stable performance due to the mutual diffusion of aluminum and silicon. The alumina generated through the reaction forms a compact oxide film around the titanium silicon carbide crystals, enhancing antioxidation properties. Additionally, the toughness of the composite is improved by the titanium silicon carbide, making it suitable for various applications. The process is characterized by its simplicity and convenience for industrial production, with the composite material demonstrating relatively high purity, low sintering temperature, and high bending strength.
Career Highlights
Jinkai Li is affiliated with the University of Jinan, where he continues to engage in research and development in the field of composite materials. His work has garnered attention for its practical applications and innovative methodologies.
Collaborations
Jinkai Li collaborates with notable colleagues, including Qinggang Li and Zongming Liu, who contribute to his research endeavors and help advance the field of materials science.
Conclusion
Jinkai Li's contributions to the development of alumina/titanium silicon carbide composite materials highlight his innovative spirit and dedication to advancing materials science. His work not only enhances the performance of composite materials but also paves the way for future industrial applications.