Jing Xu

Title: Innovations of Jing Xu in Electrochemical Plating

Introduction

Jing Xu is a notable inventor based in Kalispell, MT (US), recognized for her contributions to the field of electrochemical plating. With a total of four patents to her name, she has made significant advancements in the development of nanotwin copper materials and semiconductor plating processes.

Latest Patents

One of her latest patents focuses on the electrochemical depositions of nanotwin copper materials. This exemplary method involves contacting a patterned substrate with a plating bath in an electroplating chamber. The process includes forming a nanotwin-containing metal material within openings on the substrate through a series of cycles that utilize both forward and reverse currents. Another patent addresses plating and deplating currents for material co-planarity in semiconductor plating processes. This method involves applying a current to a liquid in a plating chamber to deposit metal on exposed portions of a substrate, utilizing alternating cycles of forward plating and reverse deplating currents.

Career Highlights

Jing Xu has established herself as a key figure in her field while working at Applied Materials, Inc. Her innovative approaches have contributed to advancements in electrochemical processes, enhancing the efficiency and effectiveness of plating techniques.

Collaborations

Throughout her career, Jing has collaborated with notable colleagues, including John Lee Klocke and Marvin L Bernt. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Jing Xu's work in electrochemical plating represents a significant contribution to the field of materials science. Her patents and collaborations highlight her role as an influential inventor in advancing technology.