Jin Yul Kim

Title: Jin Yul Kim: Innovator in Semiconductor Packaging

Introduction

Jin Yul Kim is a prominent inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 3 patents. His work focuses on innovative designs that enhance the functionality and efficiency of semiconductor devices.

Latest Patents

Among his latest patents, Jin Yul Kim has developed a fan-out semiconductor package that includes a semiconductor chip, an encapsulant, and an interconnection member. This package features connection pads on the semiconductor chip, with the encapsulant encapsulating a portion of the chip. The interconnection member consists of a first insulating layer, a redistribution layer, and a second insulating layer, with the latter being thicker than the first.

Another notable patent is a fan-out semiconductor package that incorporates a first interconnection member with a through-hole. This design allows a semiconductor chip to be placed within the through-hole, featuring an active surface with connection pads. The encapsulant encapsulates portions of the first interconnection member and the inactive surface of the chip. The second interconnection member is positioned on the first interconnection member and the active surface, with a passivation layer on top. This innovative design ensures that the redistribution layers are electrically connected to the connection pads of the semiconductor chip.

Career Highlights

Jin Yul Kim is currently employed at Samsung Electronics Co., Ltd., where he continues to push the boundaries of semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor packaging, making significant impacts in the industry.

Collaborations

Throughout his career, Jin has collaborated with notable colleagues, including Doo Hwan Lee and Jong Rip Kim. These collaborations have fostered an environment of innovation and creativity, leading to groundbreaking advancements in semiconductor technology.

Conclusion

Jin Yul Kim's contributions to semiconductor packaging exemplify his dedication to innovation and excellence in the field. His patents reflect a deep understanding of the complexities involved in semiconductor design, positioning him as a key figure in the industry.