Gyeonggi-do, South Korea

Jin Young Ock

USPTO Granted Patents = 1 

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2020

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1 patent (USPTO):Explore Patents

Title: The Innovative Mind of Jin Young Ock: Pioneering Fan-Out Wafer Level Packaging

Introduction: Jin Young Ock is a distinguished inventor based in Gyeonggi-do, South Korea, known for his significant contributions to the field of semiconductor packaging. With a focus on enhancing the performance and reliability of electronic devices, Ock has been instrumental in designing packaging solutions that optimize heat dissipation and minimize warpage.

Latest Patents: Jin Young Ock holds a patent for a groundbreaking invention titled "Metal Core Solder Ball Interconnector Fan-Out Wafer Level Package." This innovative package comprises a redistribution layer and a semiconductor chip that is electrically connected to the layer through a bump. A protective member safeguards the semiconductor chip, with a section removed to expose its upper surface for effective heat dissipation. The interconnector, located outside the semiconductor chip, includes a metal core solder ball comprised of copper (Cu), nickel (Ni), and silver (Ag). This design significantly enhances electrical connectivity while ensuring durability.

Career Highlights: Currently, Jin Young Ock is affiliated with Hana Micron Inc., a company renowned for its expertise in semiconductor packaging solutions. Ock’s work focuses on advancing technology that improves the functionality of electronic components, ensuring they meet the demands of modern applications.

Collaborations: Jin Young Ock has collaborated with notable colleagues, including Hyun Woo Lee and Jin Wook Jeong. Their collective efforts have fostered innovation in the semiconductor industry, contributing to the development of cutting-edge packaging technologies that set new standards for performance.

Conclusion: With his patent and ongoing contributions to the field, Jin Young Ock stands out as a key innovator in semiconductor packaging. His commitment to improving electronic device efficiency reflects the importance of innovation in driving technological advancements. As the industry evolves, Ock's work will undoubtedly play a pivotal role in shaping the future of electronic packaging solutions.

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