This inventor holds 1 USPTO granted patent. Top assignee: Tubis Technology Inc.. Active years: 2017.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2017
Title: Innovations of Jin-Fu Yeh in 3D Packaging Technology
Introduction
Jin-Fu Yeh is a notable inventor based in Pasadena, California. He has made significant contributions to the field of power amplifier technology. His innovative approach focuses on enhancing the efficiency and compactness of power amplifier assemblies.
Latest Patents
Jin-Fu Yeh holds a patent for a "3D packaging of power amplifier dice apparatus and articles of manufacture." This invention provides a compact assembly of power amplifiers arranged in series and parallel configurations. The design incorporates a plurality of radial power splitters and combiners that effectively couple surface-mounted power amplifier dice into a power platter. Additionally, thermal conduction probes are integrated to remove heat from the vicinity of the power amplifier dice, ensuring optimal performance. The surface-mounted power amplifier dice can be enclosed within matched pairs of power platters, and stackable power platters can be assembled to form a 3D power amplifier pile.
Career Highlights
Jin-Fu Yeh is currently associated with Tubis Technology Inc., where he continues to innovate in the field of power amplification. His work has been instrumental in advancing the technology used in various electronic applications.
Conclusion
Jin-Fu Yeh's contributions to 3D packaging technology for power amplifiers demonstrate his commitment to innovation and efficiency in electronic design. His patent reflects a significant advancement in the field, showcasing his expertise and dedication to improving power amplifier systems.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile