Nanjing, China

Jiaxin Wang


Average Co-Inventor Count = 10.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Innovations of Jiaxin Wang in Copper Azide Preparation

Introduction

Jiaxin Wang is a notable inventor based in Nanjing, China. He has made significant contributions to the field of materials science, particularly in the preparation of copper azide and cuprous azide. His innovative methods have implications for enhancing electrostatic safety in various applications.

Latest Patents

Jiaxin Wang holds a patent for a method titled "Method for preparing copper azide and cuprous azide encapsulated by conductive metal-organic framework." This method utilizes a conductive copper-containing metal-organic framework material as a precursor. The azidation of the precursor is completed through a liquid-solid electrochemical azidation reaction. The resulting copper azide and cuprous azide nanocrystals are uniformly embedded within a conductive framework, effectively preventing agglomeration and reducing static charge generated by friction and displacement. This innovative approach not only enhances charge transfer but also improves electrostatic safety.

Career Highlights

Jiaxin Wang is affiliated with Nanjing University of Science and Technology, where he continues to advance research in materials science. His work is characterized by a focus on safety and efficiency, with a preparation process that is compatible with MEMS technology. This compatibility is crucial for the application of copper azide and cuprous azide materials in micro devices.

Collaborations

Jiaxin Wang collaborates with esteemed colleagues, including Wenchao Zhang and Chunpei Yu. Their combined expertise contributes to the advancement of innovative solutions in their field.

Conclusion

Jiaxin Wang's contributions to the preparation of copper azide and cuprous azide encapsulated by conductive metal-organic frameworks represent a significant advancement in materials science. His innovative methods enhance safety and efficiency, paving the way for future applications in micro devices.

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