Jianyu Du

Title: Innovations of Jianyu Du in Silicon-Based Packaging Technology

Introduction

Jianyu Du is a prominent inventor based in Beijing, China. He has made significant contributions to the field of silicon-based packaging technology. His innovative work focuses on enhancing the efficiency and functionality of electronic components through advanced packaging solutions.

Latest Patents

Jianyu Du holds a patent for a "Silicon-based fan out package structure and preparation method therefor." This patent describes a silicon-based fan out package structure that includes embedded manifold type microchannels. The structure consists of a chip with a substrate and embedded microchannels located on the back of the substrate. It also features a silicon-based adapter plate with a groove for burying the chip, a manifold channel, a liquid inlet, and a liquid outlet. Additionally, a low-temperature sealing layer is used to seal the embedded microchannels with the manifold channel, and a rewiring layer is positioned at the top of the chip.

Career Highlights

Jianyu Du is affiliated with Peking University, where he continues to advance his research and development in the field of silicon-based technologies. His work has garnered attention for its potential applications in various electronic devices.

Collaborations

Jianyu has collaborated with notable colleagues such as Wei Wang and Yuchi Yang. Their combined expertise contributes to the innovative projects undertaken at Peking University.

Conclusion

Jianyu Du's contributions to silicon-based packaging technology exemplify the importance of innovation in the electronics industry. His patent and ongoing research reflect a commitment to advancing technology for improved electronic performance.