Hefei, China

Jian Feng

USPTO Granted Patents = 2 

Average Co-Inventor Count = 10.0

ph-index = 1


Company Filing History:


Years Active: 2025

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2 patents (USPTO):Explore Patents

Title: Innovations of Jian Feng in Electromagnetic Field Simulation

Introduction

Jian Feng is a notable inventor based in Hefei, China. He has made significant contributions to the field of electromagnetic field simulation and materials science. With a total of 2 patents, his work showcases innovative approaches to technology and engineering.

Latest Patents

One of Jian Feng's latest patents is titled "Broadband infrared absorber based on epsilon-near-zero material." This invention describes a broadband near-infrared absorber that includes a wide-type cross-shaped gold layer, an indium tin oxide (ITO) thin film, a silicon dioxide (SiO) layer, and a hollowed-out cross-shaped gold layer arranged from top to bottom. The design ensures that the length and width of the cross-shaped gold layer match those of the hollowed-out counterpart, while their thicknesses differ.

Another significant patent is the "Electromagnetic field simulation method based on face-centered cubic and subgrid technique." This method provides a framework for simulating electromagnetic fields using a face-centered cubic structure and a subgrid. It involves setting periodic boundary conditions and a metal plate to construct an electromagnetic field simulation model. The model allows for the simulation of the electric field and the generation of moment domain waveform diagrams within the simulation region.

Career Highlights

Jian Feng is affiliated with Anhui University, where he continues to advance his research and innovations. His work has garnered attention for its practical applications in various technological fields.

Collaborations

Jian Feng collaborates with esteemed colleagues, including Ming Fang and Zhixiang Huang. Their combined expertise contributes to the advancement of research and innovation in their respective areas.

Conclusion

Jian Feng's contributions to the field of electromagnetic field simulation and materials science highlight his innovative spirit and dedication to advancing technology. His patents reflect a commitment to developing practical solutions that can impact various industries.

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