Company Filing History:
Years Active: 2023
Title: Jialing Tong: Innovator in Integrated Circuit Technology
Introduction
Jialing Tong is a prominent inventor based in San Diego, California. He is known for his contributions to the field of integrated circuit technology. His innovative work has led to the development of a unique patent that enhances the efficiency of IC packages.
Latest Patents
Jialing Tong holds a patent for an "Integrated circuit (IC) package with stacked die wire bond connections." This invention features two stacked IC dies, where the first die couples directly to a metallization structure. The second die, stacked on top of the first, connects to the metallization structure through wire bond connections. The IC dies are interconnected via an interior metal layer of the metallization structure, utilizing vias to couple to this layer. This advancement represents a significant step forward in IC packaging technology.
Career Highlights
Jialing Tong is currently employed at Qualcomm Incorporated, a leading company in the telecommunications and semiconductor industry. His work at Qualcomm has allowed him to focus on cutting-edge technologies that drive innovation in mobile communications.
Collaborations
Jialing collaborates with talented colleagues, including Kuiwon Kang and Michelle Yejin Kim. Their combined expertise contributes to the development of advanced technologies in the field.
Conclusion
Jialing Tong's contributions to integrated circuit technology exemplify the spirit of innovation. His patent for an IC package with stacked die wire bond connections showcases his commitment to advancing the field. Through his work at Qualcomm and collaborations with skilled professionals, he continues to make a significant impact in the industry.