Attica, OH, United States of America

Jerald P Danhoff


Average Co-Inventor Count = 4.0

ph-index = 2

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 1999-2000

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2 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Jerald P. Danhoff

Introduction

Jerald P. Danhoff is a notable inventor based in Attica, Ohio, recognized for his significant contributions to the field of adhesive application technology. With a total of two patents to his name, Danhoff has developed innovative solutions that enhance the efficiency and quality of bookbinding processes.

Latest Patents

One of Danhoff's latest patents is an "Apparatus for attaching endsheets without moisture wrinkles." This machine is designed to attach a book cover to endsheets using an adhesive that is applied within a specific temperature range. The apparatus features a housing that contains an application roller and a metering roller, which work in tandem to create an adhesive reservoir. The machine is equipped with a level detector that monitors the adhesive level and a temperature sensor that ensures the application roller maintains the appropriate temperature for optimal adhesive application. This innovative design allows for the consistent application of hot melt adhesive, preventing moisture wrinkles and ensuring high-quality book production.

Career Highlights

Danhoff's career is marked by his dedication to improving adhesive application methods in the publishing industry. His work at R.R. Donnelley and Sons Company has allowed him to collaborate with other talented professionals and contribute to advancements in bookbinding technology. His patents reflect a commitment to innovation and quality in manufacturing processes.

Collaborations

Throughout his career, Danhoff has worked alongside notable colleagues

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