Company Filing History:
Years Active: 2016-2017
Title: Innovations by Jennifer Nguyen
Introduction
Jennifer Nguyen is an accomplished inventor based in Milpitas, CA (US). She has made significant contributions to the field of technology, particularly in the area of electronic components. With a total of 2 patents, her work has garnered attention for its innovative approaches and practical applications.
Latest Patents
One of her latest patents is titled "Nano-copper pillar interconnects and methods thereof." This invention relates to the development of nano-copper pillar interconnects, which are created using a mixture of nano-copper particles and organic fluxes. The nano-copper material is applied to bond pads on printed circuit boards (PCBs) through various processes, resulting in nano-copper covered PCB bond pads. Once the solvents evaporate, pure nano-copper pillar interconnects are formed, effectively coupling components with the PCB bond pads.
Another notable patent is "Fixture design for pre-attachment package on package component assembly." This invention features a fixture design that includes a plurality of pockets arranged in an N×M array, specifically sized to receive bottom packages. The design incorporates global and local fiducials for precise positioning, as well as features like ear cuts for easy component placement and a vacuum port for secure holding of the packages.
Career Highlights
Jennifer Nguyen currently works at Flextronics Ap, LLC, where she continues to innovate and develop new technologies. Her expertise in electronic component design has made her a valuable asset to her team and the company.
Collaborations
Throughout her career, Jennifer has collaborated with talented individuals such as David Geiger and Anwar Mohammed. These partnerships have contributed to her success and the advancement of her projects.
Conclusion
Jennifer Nguyen is a pioneering inventor whose work in nano-copper technology and fixture design has made a significant impact in the electronics industry. Her contributions continue to shape the future of electronic component assembly and innovation.