Location History:
- Hsinchu County 303, TW (2011)
- Hsinchu County, TW (2014)
Company Filing History:
Years Active: 2011-2014
Title: Jeng-Ru Chang: Innovator in Semiconductor Technology
Introduction
Jeng-Ru Chang is a notable inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of semiconductor technology, holding two patents that showcase his innovative approach to chip packaging.
Latest Patents
Chang's latest patents include a semiconductor chip package structure designed to achieve flip-chip type electrical connections without the use of a wire-bonding process. This innovative package structure consists of a package unit, a semiconductor chip, a first insulative layer, first conductive layers, a second insulative layer, and second conductive layers. The package unit features a receiving groove that accommodates the semiconductor chip, which is equipped with multiple conductive pads on its top surface. The first insulative layer is strategically placed between the conductive pads to provide insulation. The first conductive layers are formed on both the first insulative layer and the package unit, with one side of each layer connected to the corresponding conductive pad. Additionally, the second insulative layer is positioned between the first conductive layers to ensure they are insulated from one another. The second conductive layers are then formed on the opposite sides of the first conductive layers, completing the innovative design.
Career Highlights
Jeng-Ru Chang is currently employed at Harvatek Corporation, where he continues to push the boundaries of semiconductor technology. His work has been instrumental in advancing the efficiency and effectiveness of chip packaging solutions.
Collaborations
Chang collaborates with talented individuals such as Bily Wang and Hung-Chou Yang, contributing to a dynamic and innovative work environment.
Conclusion
Jeng-Ru Chang's contributions to semiconductor technology through his patents and work at Harvatek Corporation highlight his role as a leading inventor in the field. His innovative designs are paving the way for future advancements in chip packaging.