Company Filing History:
2 out of 79 
2 out of 42 Years Active: 2014-2015
Title: Jenchun Chen: Innovator in 3D Stacked Package Structures
Introduction
Jenchun Chen is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of electronic packaging, particularly in the development of innovative 3D stacked package structures. With a total of two patents to his name, Chen's work showcases his expertise and creativity in engineering.
Latest Patents
Chen's latest patents include a "3D stacked package structure and method of manufacturing the same." This invention features a 3D stacked package structure that consists of a first unit, a molding unit, a conductive unit, and a second unit. The first unit includes a substrate and at least one electronic component, with specific conductive pads and runners designed for efficient electrical connections. The molding unit is designed to facilitate the stacking of the first unit onto the second unit, ensuring seamless electrical connectivity through the conductive unit.
Another significant patent is the "package structure and manufacturing method thereof." This package structure comprises a substrate, multiple electronic components, and a covering layer. The design includes a first region for the first electronic components and a second region for a second electronic component. The covering layer features a recess and an exposing region for the conductive contacts, allowing for effective electronic coupling through a wiring layer.
Career Highlights
Throughout his career, Jenchun Chen has worked with prominent companies in the electronics industry. He has been associated with Universal Scientific Industrial (Shanghai) Co., Ltd. and Universal Global Scientific Industrial Co., Ltd. His experience in these organizations has contributed to his expertise in electronic packaging technologies.
Collaborations
Chen has collaborated with various professionals in his field, including Hsin Chin Chang, enhancing his innovative capabilities and expanding his knowledge base.
Conclusion
Jenchun Chen's contributions to the field of electronic packaging through his patents and career highlights demonstrate his commitment to innovation. His work in developing advanced 3D stacked package structures is a testament to his skills as an inventor.