Jen-Chan Huang

Title: Innovations of Jen-Chan Huang

Introduction

Jen-Chan Huang is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique semiconductor package that utilizes a hybrid-type adhesive.

Latest Patents

One of his key patents is titled "Semiconductor package using hybrid-type adhesive." This patent describes a semiconductor package that includes a first die, a second die, and a hybrid-type adhesive. The second die is stacked on the first die through the hybrid-type adhesive. The hybrid-type adhesive consists of a conductive adhesive and a non-conductive adhesive. The conductive adhesive is positioned between the non-conductive adhesive and the first die, while the non-conductive adhesive is placed between the conductive adhesive and the second die. This innovative approach enhances the performance and reliability of semiconductor packages.

Career Highlights

Jen-Chan Huang is currently employed at Airoha Technology Corporation, where he continues to push the boundaries of semiconductor technology. His work has garnered attention for its practical applications and potential impact on the industry.

Collaborations

He collaborates with talented colleagues, including Ying-Chih Chen and Min-Yu Lin, who contribute to the innovative environment at Airoha Technology Corporation.

Conclusion

Jen-Chan Huang's contributions to semiconductor technology exemplify the spirit of innovation. His patent on hybrid-type adhesive semiconductor packages showcases his commitment to advancing the field. His work continues to inspire future developments in technology.