Jeffery S Perkins

Title: Innovations of Jeffery S Perkins

Introduction

Jeffery S Perkins is a notable inventor based in Hauppauge, NY (US). He has made significant contributions to the field of electronic circuit packaging. With a total of 2 patents, his work focuses on innovative methods for connecting conductive layers in electronic devices.

Latest Patents

One of his latest patents is titled "Method of electrically connecting substrates using solder balls." This patent describes a method for connecting two conductive layers in an electronic circuit package. The process involves placing blind vias in both a first and a second substrate, attaching signal lines, and assembling ball grid array components to ensure electrical connectivity. Another patent, "Use of blind vias for soldered interconnections between substrates," outlines a similar method, emphasizing the incorporation of blind vias for effective electrical connections between layers.

Career Highlights

Jeffery S Perkins is currently associated with International Business Machines Corporation (IBM). His work at IBM has allowed him to explore and develop advanced technologies in electronic circuit design. His innovative approaches have contributed to the efficiency and reliability of electronic devices.

Collaborations

Throughout his career, Jeffery has collaborated with notable colleagues, including Gregg J Armezzani and Kishor V Desai. These collaborations have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Jeffery S Perkins is a distinguished inventor whose work in electronic circuit packaging has led to significant advancements in the field. His patents reflect a commitment to innovation and excellence in technology.