San Luis Obispo, CA, United States of America

Jay Singh


Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 11(Granted Patents)


Company Filing History:


Years Active: 2014-2019

Loading Chart...
3 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Jay Singh

Introduction

Jay Singh is a notable inventor based in San Luis Obispo, California. He has made significant contributions to the field of packing materials through his innovative designs and methods. With a total of three patents to his name, Singh continues to push the boundaries of technology and efficiency in packaging solutions.

Latest Patents

Singh's latest patents include a system, method, and apparatus for making and using flex column void-based packing materials. This invention features a three-sided column with a triangular cross-sectional shape, which includes an open first end and an open second end. Each of the three sides has a flex line that divides it into two portions, with at least one perforation along the edge of each portion. This design allows for enhanced flexibility and efficiency in packing materials.

Career Highlights

Throughout his career, Jay Singh has worked with various organizations, including Cal Poly Corporation. His experience in these roles has contributed to his expertise in developing innovative packing solutions. Singh's work is characterized by a commitment to improving the functionality and sustainability of packaging materials.

Collaborations

Some of Singh's notable coworkers include Evan Cernokus and William Kutz. Their collaborative efforts have likely played a role in the development of his innovative patents.

Conclusion

Jay Singh's contributions to the field of packing materials demonstrate his dedication to innovation and efficiency. His patents reflect a deep understanding of material science and design, positioning him as a key figure in the industry.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…