Toledo, OH, United States of America

Jay Myers

USPTO Granted Patents = 2 

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2019-2021

Loading Chart...
2 patents (USPTO):Explore Patents

Title: Innovations by Jay Myers in Polymer Foam Technology

Introduction

Jay Myers is an accomplished inventor based in Toledo, OH, known for his significant contributions to the field of polymer foam technology. With a total of 2 patents, he has developed innovative methods that enhance the properties and applications of polymer foams.

Latest Patents

Myers' latest patents include a groundbreaking process for sub-ambient pressure morphology control in molding extruded polymer foams. This method allows for the production of both skinned and un-skinned foams, which feature smooth interior and exterior surfaces, controlled surface porosity, and skins of pre-defined thickness. The foam cells created through this process are expanded and oriented in a manner that enhances their structural integrity, resulting in improved bending and compressive strength.

Career Highlights

Jay Myers is currently employed at Toledo Molding & Die, Inc., where he applies his expertise in polymer foam technology. His work focuses on developing lightweight components that meet the demands of various industries, showcasing his commitment to innovation and quality.

Collaborations

Throughout his career, Myers has collaborated with talented individuals such as Brian Beard and Pete Ermie, contributing to a dynamic work environment that fosters creativity and advancement in polymer technology.

Conclusion

Jay Myers continues to make strides in the field of polymer foam technology, with his innovative patents paving the way for enhanced materials and applications. His work exemplifies the impact of dedicated inventors in advancing industry standards and improving product performance.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…