Company Filing History:
Years Active: 2019
Title: Jay Lewis - Innovator in Flexible Electronic Assemblies
Introduction
Jay Lewis is a notable inventor based in Durham, NC (US). He has made significant contributions to the field of flexible electronics, particularly through his innovative patent. His work focuses on the integration of electronic devices into flexible substrates, paving the way for advancements in electronic assembly technology.
Latest Patents
Jay Lewis holds a patent for "Flexible electronic assemblies with embedded electronic devices and methods for their fabrication." This invention describes a flexible electronic assembly that includes a flexible current-carrying device, an electrically insulating flexible substrate, and an electronic device embedded within the substrate. The electronic device is mounted face-down on the current-carrying device, allowing for a co-planar configuration at the interface. This design results in an ultra-thin assembly, measuring on the order of micrometers, which is a significant advancement in the field.
Career Highlights
Jay Lewis is associated with the Research Triangle Institute, where he continues to explore and develop innovative solutions in electronic assembly. His work has garnered attention for its potential applications in various industries, including consumer electronics and wearable technology.
Collaborations
Some of his coworkers include Dorota Temple and Erik Paul Vick, who contribute to the collaborative environment at the Research Triangle Institute. Their combined expertise fosters innovation and drives the development of cutting-edge technologies.
Conclusion
Jay Lewis is a pioneering inventor whose work in flexible electronic assemblies is shaping the future of electronic device integration. His contributions are vital to the advancement of technology in this rapidly evolving field.