Hortonville, WI, United States of America

Jay D Hodson

USPTO Granted Patents = 4 

 

Average Co-Inventor Count = 3.6

ph-index = 1


Location History:

  • Osh Kosh, WI (US) (2020)
  • Hortonville, WI (US) (2024)

Company Filing History:


Years Active: 2020-2025

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4 patents (USPTO):Explore Patents

Title: Innovations by Jay D Hodson: A Pioneer in Packaging Solutions

Introduction

Jay D Hodson is an accomplished inventor based in Hortonville, Wisconsin, renowned for his contributions to packaging technology. With three patents to his name, he has made significant advancements in the design and functionality of flexible packaging solutions.

Latest Patents

Among his latest innovations is the "Package with Supplemental Seal." This inventive packaging solution features a fitment seal with an inclined angle that connects various edges, ensuring enhanced sealing capabilities. Additionally, there is at least one supplemental seal inclined at an angle from 90° to 180° relative to the adjacent seal, aimed at improving the integrity of the package.

Another noteworthy patent is the "Flexible Carrying Case." This thermoplastic flexible package is designed with both non-shrinkable and shrinkable panels, each contributing to the package's structural versatility. Through the use of longitudinal and transverse panel seals, Hodson's design allows for a gusset that enhances capacity and usability.

Career Highlights

Jay D Hodson is currently associated with Amcor Flexibles North America, Inc., a leading name in the flexible packaging industry. His role at the company has been pivotal in driving innovative solutions that cater to market demands and consumer needs.

Collaborations

Throughout his career, Hodson has had the privilege of collaborating with talented colleagues, including Andrea Bouma and Dawn Merrill. Their synergy and teamwork have significantly contributed to the successful development of innovative packaging solutions.

Conclusion

With a strong focus on innovation, Jay D Hodson continues to push the boundaries of packaging technology. His patents exemplify a commitment to creating functional and effective solutions in the flexible packaging sector, showcasing his dedication as an inventor and industry leader.

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