Company Filing History:
Years Active: 1997-1998
Title: Jason Reid: Innovator in Conductive Barrier Layer Technology
Introduction
Jason Reid is a notable inventor based in Pasadena, CA. He has made significant contributions to the field of conductive materials, holding a total of 3 patents. His work focuses on enhancing the performance and stability of electronic components through innovative barrier layer technologies.
Latest Patents
One of Jason Reid's latest patents is titled "Conductive noble-metal-insulator-alloy barrier layer." This invention features a preferred embodiment that includes an oxidizable layer, such as TiN, a noble-metal-insulator-alloy barrier layer, like Pd-Si-N, overlying the oxidizable layer, an oxygen stable layer, such as platinum, and a high-dielectric-constant material layer, like barium strontium titanate. The noble-metal-insulator-alloy barrier layer plays a crucial role in inhibiting the diffusion of oxygen to the oxidizable layer, thereby minimizing harmful oxidation.
Another patent by Reid is the "Method of forming conductive noble-metal-insulator-alloy barrier layer," which shares similar components and functions as the previous invention. This method also emphasizes the importance of the noble-metal-insulator-alloy barrier layer in protecting the oxidizable layer from oxidation.
Career Highlights
Throughout his career, Jason Reid has worked with prominent organizations, including Texas Instruments Corporation and the California Institute of Technology. His experience in these institutions has allowed him to develop and refine his innovative ideas in conductive materials.
Collaborations
Jason has collaborated with notable colleagues, including Scott Robert Summerfelt and Marc A Nicolet. These partnerships have contributed to the advancement of his research and inventions.
Conclusion
In summary, Jason Reid is a distinguished inventor whose work in conductive barrier layer technology has led to multiple patents. His innovative approaches continue to influence the field of electronics and materials science.