Jason Andrach

Title: Jason Andrach: Innovator in Dicing Technology

Introduction

Jason Andrach is a notable inventor based in Santa Barbara, California. He has made significant contributions to the field of dicing technology, particularly in the area of photonic chips. His innovative approach has the potential to enhance the efficiency and effectiveness of semiconductor packaging.

Latest Patents

Jason holds a patent for a system titled "Saw Assisted Facet Etch Dicing." This invention presents a novel method for separating die on a wafer in preparation for packaging. The technique results in smooth diced edges, which is particularly advantageous for edge-coupled photonic chips. The method involves etching from the front side of the wafer and dicing from the back side, ensuring complete separation of die. This process creates an optically smooth surface on the front side of the wafer, allowing for direct mounting of adjacent devices with minimal coupling loss and low optical scattering. Additionally, the backside dicing may be wider than the front side etch, preventing rough surfaces that could inhibit the direct joining of adjacent devices.

Career Highlights

Jason is currently employed at Genxcomm, Inc., where he continues to develop innovative solutions in the field of photonics. His work has garnered attention for its practical applications and potential to advance technology in the industry.

Collaborations

Jason collaborates with talented individuals such as Brian Mattis and Taran Huffman, contributing to a dynamic team focused on pushing the boundaries of technology.

Conclusion

Jason Andrach's contributions to dicing technology exemplify the spirit of innovation in the semiconductor industry. His patented methods not only improve the efficiency of device packaging but also pave the way for advancements in photonic applications.