Jas Chudasama

Title: Innovations by Jas Chudasama

Introduction

Jas Chudasama is an accomplished inventor based in Milpitas, CA (US). He has made significant contributions to the field of copper plating, holding a total of 5 patents. His innovative methods focus on improving the efficiency and effectiveness of copper surface treatments.

Latest Patents

One of Jas Chudasama's latest patents is a copper plating method that discloses a technique for removing copper oxide from copper surfaces. This method involves the application of vapor generated by an ultrasonic wave nebulizer. The energized vapor droplets consist of water and a weak organic acid, such as acetic acid, lactic acid, citric acid, uric acid, oxalic acid, or formic acid, which have a vapor pressure similar to that of water. The weak organic acid is chosen to have a pKa high enough to avoid etching the copper while being sufficiently acidic to remove copper oxide at a rate compatible with high throughput manufacturing. In one embodiment, the weak acid/water vapor is applied to a substrate in a spin bowl, followed by a deionized water rinse step in the same bowl. This process results in improved wettability and uniformity in subsequently plated copper films, leading to considerable cost savings due to reduced chemical consumption and higher product yields.

Another notable patent by Chudasama is also focused on a copper plating method that activates a copper seed layer during the plating process. Similar to the previous method, it utilizes vapor generated by an ultrasonic wave nebulizer, incorporating water and a weak organic acid. The application of this vapor enhances the activation of the copper seed layer, ensuring better results in the plating process.

Career Highlights

Jas Chudasama is currently employed at Headway Technologies, Incorporated, where he continues to innovate in the field of copper plating. His work has been instrumental in advancing techniques that enhance manufacturing processes and product quality.

Collaborations

Throughout his career, Jas has collaborated with notable colleagues, including Chao-Peng Chen and Chien-Li Lin. These collaborations have contributed to the development of effective solutions in the field of copper plating.

Conclusion

Jas Chudasama's contributions to the field of copper plating through his innovative patents demonstrate his commitment to advancing manufacturing techniques. His work not only improves product quality but also leads to significant cost savings in the industry