Jari Hiltunen

Title: Jari Hiltunen: Innovator in Camera Technology

Introduction

Jari Hiltunen is a notable inventor based in Mouhijarvi, Finland. He has made significant contributions to the field of camera technology, holding a total of 4 patents. His work focuses on enhancing the functionality and quality of camera modules, particularly in compact devices.

Latest Patents

One of Hiltunen's latest innovations is the reflowable camera module with integrated flash. This invention utilizes a Chip Scale Package (CSP) to implement a camera module where an image sensor is formed on one portion of the carrier, while a light-emitting diode (LED) serves as an integrated camera flash on another portion. The design includes additional optical isolation to prevent stray light from degrading image quality. Another significant patent is the multilayer chip scale package, which employs a resin-coated copper foil to fabricate a multilayer CSP. This package features a first electrical routing layer, with a second layer formed by hot pressing and patterning the resin-coated copper foil. Conductive vias are created between the electrical routing layers, and an Organic Solder Preservative (OSP) is used as a surface finish for the solder balls of the CSP.

Career Highlights

Hiltunen's career is marked by his role at Omnivision Technologies, Inc., where he has been instrumental in developing advanced camera technologies. His expertise in CSP design and implementation has positioned him as a key player in the industry.

Collaborations

Throughout his career, Hiltunen has collaborated with talented individuals such as Jess Jan Young Lee and Ian Montandon. These partnerships have contributed to the successful development of innovative camera solutions.

Conclusion

Jari Hiltunen's contributions to camera technology through his patents and collaborations highlight his role as an influential inventor in the field. His work continues to impact the development of advanced imaging solutions.