Paderborn, Germany

Jan Ditter


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Jan Ditter: Innovator in Adhesive Bonding Solutions

Introduction

Jan Ditter is a notable inventor based in Paderborn, Germany. He has made significant contributions to the field of adhesive bonding through his innovative methods and technologies. His work focuses on improving the efficiency and effectiveness of cleaning methods for adhesive residues.

Latest Patents

Jan Ditter holds a patent for a method designed for cooling and/or separating adhesively bonded components and for removing adhesive residues from surfaces. The patent, titled "Method for cooling and/or separating adhesively bonded components and/or removing adhesive residues from surfaces and jet apparatus herefor," describes a cleaning method that utilizes liquid carbon dioxide. This method is particularly effective after separating adhesive connections between joined partners. The process involves guiding liquid carbon dioxide through a jet apparatus, where it is mixed with a cold-resistant liquid to create a powerful cleaning jet that effectively removes adhesive residues.

Career Highlights

Jan Ditter is associated with Mycon GmbH, where he applies his expertise in adhesive technologies. His innovative approach has led to advancements in cleaning methods that are both efficient and environmentally friendly. His patent reflects his commitment to improving industrial processes and enhancing product quality.

Collaborations

Jan has worked alongside talented colleagues, including Michael Wibbeke and Gerson Meschut. Their collaborative efforts contribute to the innovative environment at Mycon GmbH, fostering the development of cutting-edge solutions in adhesive bonding.

Conclusion

Jan Ditter's contributions to the field of adhesive bonding through his innovative patent demonstrate his dedication to advancing technology in this area. His work not only enhances industrial processes but also sets a standard for future innovations in adhesive applications.

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