Company Filing History:
Years Active: 2008
Title: Jamin Ling: Innovator in Semiconductor Technology
Introduction
Jamin Ling is a notable inventor based in Horsham, PA (US). He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent.
Latest Patents
Jamin Ling holds a patent for an "Integrated ball and via package and formation process." This patent describes a method of processing a semiconductor device, which includes providing a semiconductor device supported by a carrier structure. The carrier structure defines a plurality of vias from a first surface adjacent to the semiconductor device to a second surface. The method also involves extending a conductor through one of the vias, ensuring that a first end of the conductor at least partially extends below the second surface. Additionally, another portion of the conductor is electrically coupled to a portion of the semiconductor device.
Career Highlights
Jamin Ling is currently employed at Kulicke and Soffa Industries, Inc., where he continues to work on advancing semiconductor technologies. His expertise and innovative approach have made him a valuable asset to the company.
Collaborations
One of Jamin Ling's notable coworkers is David T Beatson. Their collaboration contributes to the innovative environment at Kulicke and Soffa Industries, Inc.
Conclusion
Jamin Ling's work in semiconductor technology exemplifies the impact of innovation in the industry. His patent and contributions continue to shape the future of semiconductor processing.