James Zaccardi

Title: Innovations of James Zaccardi

Introduction

James Zaccardi is an accomplished inventor based in Chandler, AZ (US). He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on improving the efficiency and functionality of semiconductor packages.

Latest Patents

Zaccardi's latest patents include a "Method and apparatus for stacked die package with insulated wire bonds." This innovation describes a semiconductor package that features a substrate with multiple contact pads. A first semiconductor die is mounted to the substrate, and first bond wires are formed between the center-row contact pads of the first semiconductor die and the substrate contact pads. These bond wires are coated with an electrically insulative material that covers part of the surface of the bumped end. An epoxy material is then applied over the first semiconductor die, allowing a second semiconductor die to be mounted on top. Second bond wires are similarly formed, ensuring that the second semiconductor die is effectively connected to the substrate.

Career Highlights

Throughout his career, Zaccardi has worked with notable companies such as White Electronic Designs Corporation and Microsemi Corporation. His experience in these organizations has contributed to his expertise in semiconductor technologies and innovations.

Collaborations

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Conclusion

James Zaccardi's contributions to semiconductor technology through his patents demonstrate his innovative spirit and technical expertise. His work continues to influence advancements in the field.