James T Rates

Title: The Innovative Mind of James T. Rates

Introduction

James T. Rates, an inventive mind hailing from Longwood, FL, has made a significant contribution to the semiconductor industry with his unique patent. With a strong focus on enhancing the efficiency and reliability of multichip modules, Rates has established himself as a noteworthy inventor in his field.

Latest Patents

James T. Rates holds a patent for a groundbreaking method titled “Method for providing known good bare semiconductor die.” This innovative process involves a temporary, non-intrusive electrical connection to the bond pads of semiconductor dies. By utilizing modified tape automated bonding (TAB) techniques, particularly with gold bumped die bond pads, the method allows for testing and burn-in of bare dies. After the testing phase, this temporary connection can be removed without needing to reform the gold bumps, making the dies ready for use in multichip modules. The patent details an intricate bonding process using gold inner leads that are diffusion bonded to the gold bumps, ensuring both a reliable electrical connection during testing and an easy removal post-process.

Career Highlights

James T. Rates is associated with Chip Supply, Inc., where his skills in semiconductor technology and engineering have shone brightly. His contributions have not only advanced the operational capabilities of his company but have also impacted the broader industry by addressing common challenges faced in the reliability of multichip modules.

Collaborations

Throughout his career, Rates has likely collaborated with various experts and research institutions, ensuring that his inventions meet the rigorous standards required in the semiconductor sector. While specific collaborative efforts may not be publicly documented, the implications of his work suggest a strong network of interactions with fellow innovators and engineers.

Conclusion

The work of James T. Rates exemplifies the spirit of innovation that drives advancements in technology today. His patent for a method of providing known good bare semiconductor dice not only improves current testing methodologies but also enhances the reliability of electronic components used in multichip modules. As he continues his journey in the semiconductor industry, his contributions will undoubtedly pave the way for future innovations.