Anaheim, CA, United States of America

James R Rau, Deceased


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2007

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of James R Rau

Introduction

James R Rau, a notable inventor from Anaheim, CA, made significant strides in the field of integrated circuit packaging. Though he is now deceased, his legacy continues through his innovative inventions, particularly his patented development in high-density 3-D integrated circuit technology. His work contributed to advancements in electronic circuitry that are pivotal in today's technological landscape.

Latest Patents

James R Rau has been credited with one notable patent, which focuses on a high-density 3-D integrated circuit package. The patent describes a slotted file created by connecting two side walls and a back wall. The side walls have etched grooves that face directly across from each other. In this design, the platelet features flanges that fit into the grooves, allowing the assembly of a completed cube when the platelets fill the slotted file. This patent emphasizes efficiency and compactness, addressing the demand for miniaturized electronic components.

Career Highlights

During his career, James R Rau was associated with Honeywell International Inc., a leading technology and manufacturing company. His role in the company allowed him to collaborate on various projects that merged innovation with practical applications in technology. His work has had a lasting impact on how integrated circuits are designed and implemented.

Collaborations

Throughout his career, James R Rau worked alongside notable colleagues such as Gerard Sullivan and Larry R Adkins. These collaborations not only fostered a thriving environment for innovation but also contributed to the collective success of projects that transformed the industry standards in electronic packaging.

Conclusion

The innovations brought forth by James R Rau have left an indelible mark on the field of integrated circuit technology. His patent for a high-density 3-D integrated circuit package illustrates his visionary approach to solving complex engineering challenges. Rau’s contributions continue to inspire current and future innovators in the field of electronics.

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