Company Filing History:
Years Active: 2023
Title: Innovations by James Mullins in Semiconductor Cutting Methods
Introduction
James Mullins is an accomplished inventor based in Hillsboro, OR (US). He is known for his innovative contributions to the field of semiconductor manufacturing. His work has significantly impacted the efficiency and precision of cutting methods used in the industry.
Latest Patents
James Mullins holds a patent for a method titled "Method for simultaneously cutting a plurality of disks from a workpiece." This method is designed to cut semiconductor wafers effectively. The process involves cutting a semiconductor ingot into a workpiece and sawing the workpiece into slices using a wire grid with a fixed abrasive grain wire. The method begins with an initial cutting speed of less than 2 mm/min and a coolant flow of less than 0.1 l/h, while the wire speed exceeds 20 m/s. As the workpiece engages with the wire grid, the coolant flow is increased to at least 2000 l/h, and the cutting speed is adjusted to optimize the cutting process.
Career Highlights
Throughout his career, James Mullins has worked with notable companies in the semiconductor industry, including Siltronic Corporation and Siltronic AG. His experience in these organizations has allowed him to refine his skills and contribute to advancements in semiconductor technology.
Collaborations
James has collaborated with several professionals in his field, including Guenther Grupp Mueller and James Mal. These collaborations have fostered innovation and the sharing of ideas, further enhancing the development of cutting-edge technologies.
Conclusion
James Mullins is a significant figure in the semiconductor industry, with a focus on improving cutting methods for semiconductor wafers. His patent and career achievements reflect his dedication to innovation and excellence in his field.