Company Filing History:
Years Active: 2023
Title: Innovations by James Mal in Semiconductor Cutting Methods
Introduction
James Mal is an accomplished inventor based in Portland, OR (US). He has made significant contributions to the field of semiconductor manufacturing, particularly through his innovative methods for cutting semiconductor wafers. His work has implications for the efficiency and precision of semiconductor production.
Latest Patents
James Mal holds a patent for a method that allows for the simultaneous cutting of a plurality of disks from a workpiece. This method involves cutting a semiconductor ingot into a workpiece and sawing the workpiece into slices using a wire grid with a fixed abrasive grain wire. The process begins with an initial cutting speed of less than 2 mm/min and a coolant flow of less than 0.1 l/h, while the wire speed exceeds 20 m/s. As the workpiece is guided through the wire grid, the coolant flow is increased to at least 2000 l/h, and the cutting speed is adjusted to optimize the cutting process.
Career Highlights
Throughout his career, James Mal has worked with notable companies in the semiconductor industry, including Siltronic Corporation and Siltronic AG. His experience in these organizations has allowed him to refine his skills and contribute to advancements in semiconductor technology.
Collaborations
James has collaborated with talented individuals in his field, including Guenther Grupp Mueller and Adam Marion. These collaborations have fostered innovation and have been instrumental in the development of his patented methods.
Conclusion
James Mal's innovative approach to cutting semiconductor wafers showcases his expertise and dedication to advancing technology in the semiconductor industry. His contributions are vital for improving manufacturing processes and enhancing the efficiency of semiconductor production.