Beavercreek, OH, United States of America

James M Huff


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2011

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Innovations by James M. Huff

Introduction

James M. Huff is an accomplished inventor based in Beavercreek, OH (US). He holds a patent that showcases his innovative approach to solving surface defects. His work is significant in the field of repair technologies, demonstrating his commitment to enhancing product durability and functionality.

Latest Patents

James M. Huff's notable patent is titled "Method and apparatus for repairing a surface defect." This invention includes a repair kit that features a sealed package with multiple isolated compartments. These compartments hold substances that, when mixed, create an adhesive, as well as a flexible substrate. The design incorporates pull tabs that facilitate the opening of fluid communication between the compartments, allowing for the mixing of the adhesive and its application onto the substrate for effective repair purposes. He has 1 patent to his name.

Career Highlights

James M. Huff is associated with Cdo Technologies, Inc., where he contributes his expertise in developing innovative repair solutions. His work at the company reflects his dedication to advancing technology in practical applications.

Collaborations

Throughout his career, James has collaborated with talented individuals such as Mark DeRyke and Kenneth M. Gannon. These partnerships have likely enriched his work and contributed to the success of his inventions.

Conclusion

James M. Huff's contributions to the field of repair technologies exemplify his innovative spirit and dedication to improving product functionality. His patent reflects a significant advancement in the methods available for addressing surface defects.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…