James H Small

Title: James H Small - Innovator in Thermally Removable Encapsulants

Introduction

James H Small is a notable inventor based in Santa Fe, NM (US). He has made significant contributions to the field of polymeric materials, particularly in the development of thermally removable encapsulants. His innovative approach has implications for the protection of electronic components, enhancing their repair and modification processes.

Latest Patents

James H Small holds a patent for a method of making thermally removable polymeric encapsulants. This patent describes a process that involves heating a mixture of at least one bis(maleimide) compound and at least one monomeric tris(furan) or tetrakis(furan) compound at temperatures from above room temperature to less than approximately 90°C. The resulting gel can be cooled to form the encapsulant, which can be easily removed by heating to temperatures greater than approximately 90°C, preferably in a polar solvent. This encapsulant is particularly useful for protecting electronic components that may require subsequent removal for repair, modification, or quality control. He has 1 patent to his name.

Career Highlights

James H Small is currently employed at Sandia Corporation, where he continues to work on innovative solutions in materials science. His expertise in thermally removable encapsulants has positioned him as a valuable asset in the field of electronic component protection.

Collaborations

James has collaborated with notable colleagues such as Douglas A Loy and David R Wheeler, contributing to advancements in their respective fields.

Conclusion

James H Small's work in developing thermally removable encapsulants showcases his innovative spirit and dedication to enhancing electronic component protection. His contributions are significant in the realm of materials science and continue to influence the industry.