James H Logsdon

Title: The Innovations of James H. Logsdon

Introduction

James H. Logsdon is a notable inventor based in Kokomo, Indiana. He has made significant contributions to the field of optical sensors and semiconductor technology. With a total of 10 patents to his name, Logsdon has demonstrated a commitment to innovation and advancement in his field.

Latest Patents

One of his latest patents is the "Infrared Sensor Package." This invention features an optical sensor package with a substrate that supports a membrane carrying an optical sensor. The design allows radiation to pass through the substrate to impinge on the sensor. The substrate includes a cavity and a window that enables infrared radiation to reach the optical sensor effectively.

Another significant patent is the "Encapsulation Wafer Process." This method involves processing a cap wafer that mates with a device wafer during die package production. The process includes depositing and etching masking layers on oxide layers, forming an oxide mask, and creating through-holes and recesses in the wafer. This innovative approach enhances the efficiency of die package production.

Career Highlights

Throughout his career, Logsdon has worked with prominent companies such as Delphi Technologies, Inc. and Delco Electronics Corporation. His experience in these organizations has contributed to his expertise in developing advanced technologies and innovative solutions.

Collaborations

Logsdon has collaborated with talented individuals in his field, including Abhijeet V. Chavan and Dan W. Chilcott. These collaborations have likely fostered a creative environment that encourages the exchange of ideas and advancements in technology.

Conclusion

James H. Logsdon's contributions to the field of optical sensors and semiconductor technology are noteworthy. His innovative patents and career achievements reflect his dedication to advancing technology. His work continues to influence the industry and inspire future inventors.