Poughkeepsie, NY, United States of America

James Edward Hitchner


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 19(Granted Patents)


Company Filing History:


Years Active: 1978

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1 patent (USPTO):Explore Patents

Title: Inventor Spotlight: James Edward Hitchner

Introduction

James Edward Hitchner is a notable inventor based in Poughkeepsie, NY, whose innovative contributions to the field of thin film interconnection systems have led to a significant patent. His work demonstrates a commitment to improving the efficiency and precision of electronic component manufacturing.

Latest Patents

James Edward Hitchner holds a patent for a method titled "Forming Self-Aligned Via Holes in Thin Film Interconnection Systems". This invention outlines a unique approach for creating self-aligned via holes that interconnect various levels of thin films on substrates. The process begins with the formation of a first-level thin film pattern, typically consisting of raised metallic stripes, atop the substrate. Following this, a dielectric material is deposited in a blanket layer, conforming to the underlying topology. The method further involves the deposition of a polymer that forms a planar surface, allowing for the selective etching of this polymer to create accurately aligned via holes in the insulator, even when mask misalignment occurs.

Career Highlights

James Edward Hitchner has made remarkable strides in his career at the International Business Machines Corporation (IBM). His groundbreaking patent reflects his ability to innovate and solve complex problems associated with thin film technology. Hitchner's expertise significantly contributes to the ongoing advancements in electronics.

Collaborations

Throughout his career, Hitchner has collaborated with esteemed colleagues such as Vivian Ruth Corbin and Bisweswar Patnaik. Working alongside other talented individuals in the industry, they have collectively focused on driving innovation and enhancing their projects.

Conclusion

James Edward Hitchner exemplifies the spirit of innovation in the technological field. With his patent for self-aligned via holes, he has demonstrated the potential for advancing electronic component manufacturing. His work is a testament to the impact that dedicated inventors can have on technology, paving the way for future advancements in the industry.

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