Company Filing History:
Years Active: 1989
Title: The Innovative Contributions of James C. Mackanic
Introduction
James C. Mackanic is a notable inventor based in Rocklin, CA (US). He has made significant contributions to the field of electrical engineering, particularly in the area of printed circuit board (PCB) technology. His innovative approach has led to the development of a unique method for obtaining electrical interconnects.
Latest Patents
Mackanic holds a patent for a method titled "Method for obtaining electrical interconnect using a solderable." This patent presents a method for providing an electrical connection between the top and bottom of a printed circuit board. The invention involves an eyelet that extends through a hole in the PCB, with a conductive layer designed to isolate a conductive pad from the rest of the layer. The eyelet is crimped to ensure mechanical retention, and the design allows for effective wave soldering, ensuring electrical coupling to the PCB's conductive layers.
Career Highlights
James C. Mackanic is associated with Hewlett-Packard Co., where he has applied his expertise in electrical engineering. His work has contributed to advancements in PCB technology, enhancing the reliability and efficiency of electronic devices.
Collaborations
Mackanic has collaborated with notable colleagues, including Dawn M. Lelko and Steven A. Shugart. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
James C. Mackanic's contributions to the field of electrical engineering, particularly through his patented method for PCB interconnects, highlight his role as an influential inventor. His work continues to impact the industry, paving the way for future innovations in electronic design.