Company Filing History:
Years Active: 1995-1997
Title: Innovations by James A Roecker
Introduction
James A Roecker is a notable inventor based in Escondido, California. He has made significant contributions to the field of integrated circuit packaging and heat transfer technologies. With a total of four patents to his name, Roecker's work showcases his expertise and innovative spirit.
Latest Patents
Roecker's latest patents include a method of fabricating an integrated circuit package that incorporates a liquid. This integrated circuit package features an integrated circuit chip, a substrate that holds the chip, and a heat conduction mechanism designed to efficiently transfer heat to a fluid medium. The heat conduction mechanism is characterized by a pressed joint made primarily of aluminum or copper, which is coated with a solid polysiloxane layer. This innovative coating process is achieved without expensive equipment, involving the formation of a liquid polysiloxane solution and subsequent baking at controlled temperatures.
Another significant patent involves a heat transfer module that utilizes liquid metal. This module consists of a heat generating unit and a heat receiving unit separated by a gap. A compliant body with microscopic voids is compressed into this gap, allowing a liquid metal alloy to be absorbed and subsequently squeezed from the compliant body. This design effectively lowers thermal resistance, enhancing heat transfer efficiency between the two units.
Career Highlights
James A Roecker is currently employed at Unisys Corporation, where he continues to develop innovative solutions in technology. His work has been instrumental in advancing the efficiency of heat transfer systems and integrated circuit packaging.
Collaborations
Roecker has collaborated with notable coworkers such as Wilber Terry Layton and Blanquita Ortega Morange. Their combined expertise has contributed to the successful development of Roecker's innovative technologies.
Conclusion
James A Roecker's contributions to the field of integrated circuit packaging and heat transfer technologies highlight his innovative capabilities. His patents reflect a commitment to advancing technology and improving efficiency in critical systems.