Yongin, South Korea

Jae-Kuk Park


Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2017-2018

Loading Chart...
2 patents (USPTO):Explore Patents

Title: Innovations by Jae-Kuk Park in Adhesive Technology

Introduction

Jae-Kuk Park is a notable inventor based in Yongin, South Korea. He has made significant contributions to the field of adhesive technology, particularly focusing on hydrophobic and water-repellent substrates. With a total of two patents to his name, Park's work showcases his innovative approach to solving practical problems in material adhesion.

Latest Patents

Jae-Kuk Park's latest patents include an adhesive composition designed for hydrophobic or water-repellent substrates. The first patent discloses an adhesive composition that comprises an epoxy resin, a modified urethane resin, an inorganic filler in nanoparticle form, and a dilution solvent. This composition can be used to adhere the same or different materials or to print patterns on hydrophobic or water-repellent substrates. The second patent also focuses on an adhesive for similar applications, featuring a modified epoxy resin, a urethane resin, and a dilution solvent. Both inventions aim to enhance the adhesion properties of materials in challenging environments.

Career Highlights

Jae-Kuk Park is currently associated with Kolon Glotech, Inc., where he continues to develop innovative adhesive solutions. His work at the company reflects his commitment to advancing adhesive technology and addressing the needs of various industries.

Conclusion

Jae-Kuk Park's contributions to adhesive technology, particularly for hydrophobic and water-repellent substrates, highlight his innovative spirit and dedication to improving material adhesion. His patents represent significant advancements in the field, showcasing the potential for practical applications in various industries.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…