Jae-Heung Lee

Title: Innovations by Inventor Jae-Heung Lee

Introduction

Jae-Heung Lee is a notable inventor based in Cheonan-si, South Korea. He is recognized for his contributions to the field of semiconductor technology, having secured two patents that significantly enhance multi-chip packaging methods.

Latest Patents

Jae-Heung Lee's latest inventions include a groundbreaking method of manufacturing a multi-chip package. The innovative design features a package substrate that supports a stacked arrangement of semiconductor chips, each equipped with bonding pads. This method employs first stud bumps positioned on the bonding pads of the semiconductor chips, with a unique configuration that facilitates effective connectivity through conductive wires. This patent not only streamlines manufacturing processes but also improves performance in electronic devices.

Career Highlights

Lee is associated with Samsung Electronics Co., Ltd., a leading global technology company. His work there highlights the importance of innovation in developing advanced semiconductor solutions, playing a critical role in maintaining the company's competitive edge in the electronics industry.

Collaborations

Throughout his career, Jae-Heung Lee has collaborated with talented professionals such as Won-Gil Han and Byong-Joo Kim. These collaborations have fostered an environment of creativity and innovation, resulting in significant advancements in their respective projects.

Conclusion

Jae-Heung Lee's contributions to the field of semiconductor technology through his innovative patents have made a lasting impact. His work at Samsung Electronics Co., Ltd. and collaborations with esteemed colleagues continue to drive forward the boundaries of electronic device capabilities.