Company Filing History:
Years Active: 2020
Title: Innovations of Jae-Cheol Kim in Semiconductor Bonding Technology
Introduction
Jae-Cheol Kim is a notable inventor based in Cheonan-si, South Korea. He has made significant contributions to the field of semiconductor technology, particularly in the area of bonding apparatuses. His innovative work has led to the development of a patent that enhances the efficiency and accuracy of semiconductor chip bonding processes.
Latest Patents
Jae-Cheol Kim holds a patent for an "Apparatus for correcting a parallelism between a bonding head and a stage, and a chip bonder including the same." This invention includes a detecting unit that determines whether the bonding head and the stage are sufficiently parallel during the bonding process. The bonding head is designed to bond a semiconductor chip to the package substrate. Additionally, a correcting unit adjusts either the bonding head or the stage based on the detecting unit's determination, ensuring optimal bonding conditions. He has 1 patent to his name.
Career Highlights
Jae-Cheol Kim is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His role involves research and development in semiconductor technologies, where he applies his expertise to improve bonding processes and equipment.
Collaborations
Some of his coworkers include Gil-Man Kang and Kyoung-Bok Cho, who collaborate with him on various projects within the semiconductor field.
Conclusion
Jae-Cheol Kim's contributions to semiconductor bonding technology demonstrate his innovative spirit and commitment to advancing the industry. His patent reflects a significant step forward in ensuring the precision of semiconductor chip bonding processes.